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globeEP-837 Two Part Staking Epoxy

Surface Resistivity: < 1.0 x 1015Ω/-cm


  • hybrid circuits
  • membrane keypads
  • electromechanical assemblies


  • Apply by dot dispense or stencil print
  • Low temperature cure
  • Excellent adhesion to most metal and plastic substrates
  • Excellent bond strength
  • Excellent temperature resistance and toughness
  • Allows for differences in coefficients of thermal expansion between two bonded substrates

Download the detailed EP-837 data sheet.

Applied Ink Solutions Product Matrix