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globeHTC-300 High Temperature Carbon Filled Ink

Surface Resistivity: < 30 Ω/square/mil

Applications:

  • Printed heater circuits
  • Flex circuits
  • Additive circuits
  • Thermal targets
  • Electrochemical sensors
  • Thermoformable substrates

Features:

  • Thermoplastic
  • Used for higher temperatures
  • Tough, durable surface finish
  • Screen printable, especially for fine line/fine pitch
  • Excellent adhesion to polyester, polyimide and copper surfaces
  • Can be blended with silver filled ink for specific resistance values

Download the detailed HTC-300 data sheet.

Applied Ink Solutions Product Matrix