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globeAG-919 Heat Stable Silver Ink

Surface Resistivity: < .040 Ω/square/mil

Applications:

  • Flex Circuits
  • Membrane Switches
  • EMI/RFI Shielding
  • Other printed electronic applications

Features:

  • High conductivity
  • Screen printable
  • Outstanding crease resistance
  • Extremely heat stable, tough, and scuff resistant
  • Has excellent adhesion to most metal surfaces, as well as to polyester polyimide and polycarbonate films.
  • Can be thinned with solvent for spraying or dipping for EMI/RFI shielding applications
  • Can be printed as thin base layers for plating processes

AG-919 is compatible with our UV curable dielectrics, silver/silver chloride inks, conductive epoxy adhesives, and our UV curable component encapsulants and conformal coatings.

Download the detailed AG-919 data sheet.

Applied Ink Solutions Product Matrix