For Your Functional Ink & Coating Requirements
Applied Ink Solutions has advanced laboratory capabilities with state of the art equipment to evaluate raw materials and analyze finished products.
Thermal Gravimetric Analysis (TGA) is an analytical technique that measures changes in a sample’s mass as a function of temperature. TGA measures a sample to 0.1 microgram precision and tests at temperatures ranging from ambient to 1000°C. TGA mimics an oven’s drying profile and provides valuable information about drying schedules tailored to the needs of a customer’s process. In addition, TGA is used for determining percent solids, percent ash, moisture content, and degradation temperature of an ink.
Differential Scanning Calorimetry (DSC) is a precise analytical method that provides information about heat flow into or out of a sample in the range of -40 oC to 400 oC. DSC performs many functions and provides vital information such as glass transition temperature (Tg), freeze/thaw points, thermal stability, and epoxy cure times. In addition to standard thermal analysis techniques, Conductive Compounds’ DSC has UV curing capabilities for studying heat flows associated with UV processes.
Thermomechanical Analysis (TMA) precisely measures the coefficient of thermal expansion (CTE) of materials as they respond to a range of temperatures. Using a fixed mechanical load on a quartz pedestal and armature, TMA captures data that determine glass transition temperature (Tg), mechanical deflection, modulus and heat distortion temperature.
Fourier Transform Infrared Spectroscopy (FTIR) uses light absorption through the entire IR spectrum for evaluating unique organic and inorganic characteristics of solids and liquids at the atomic level. Translated FTIR scan data identify a sample by a unique “fingerprint” that is analyzed and compared for detecting similarities and differences to a known sample. FTIR is an essential method for quality control of raw materials.
The Linear Taber Abrader evaluates abrasion and wear performance of a compound using constant force with fixed weight, speed and stroke length during lengthy repetitive cycling. Results from the abrader provide insight as to how compounds perform after extended use in their intended environment.
With use of innumerable jigs and cut out tools, this instrument tests and analyzes samples over a wide range of industrial standards. Common measurements include modulus, elongation, and peak load at break.
Environmental chambers enable long term testing of a customer’s circuits. Our environmental chambers can test samples from -60°C to 200°C and can vary humidity from 0 to 95%.
A goniometer uses digital imaging for precisely measuring liquid drops and contact angles of liquids applied to substrates. From these images, surface tension, adhesion and compatibility of a material to a substrate can be determined.
Conductive Compounds’ electrical test capabilities include evaluation of insulation resistance up to 10,000 volts AC, capacitance and dielectric constant, and electrical resistance from milliohms to teraohms.
Rheology testing measures the flow of compounds under varying shear force. The flow of the fluid determines how it will print, dispense and perform in other methods of application. It also measures key material properties for quality control in manufacturing.
Optical microscopes capture high magnification digital images of samples. These images are used to analyze print characteristics, surface defects, contamination and mechanical failures in materials.
Conductive Compounds performs on-site process evaluations of conditions and materials using digital microscopes, goniometers, IR thermometers and precise oven profiling equipment.