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globeSurface Mount Component Attachment

Volume Resistivity: < 1.0 x 10-3 Ω-cm

Applications:

  • Component or wire attachment
  • Filling via holes or spacers

Features:

  • Two-part electrically conductive epoxy
  • Dot dispense, screen print or manual dispense
  • Low cure temperature
  • Fast curing
  • Suitable for flexible substrates
  • 6 month shelf life
  • Available in pre-measured CC-Paks, bulk or syringes

Download the EP-600 data sheet.

Volume Resistivity: < 1.0 x 10-3 Ω-cm

Applications:

  • Component attachment & termination on hybrid circuits, membrane switches & other assemblies

Features:

  • Two-part electrically conductive epoxy
  • For stencil printing processes
  • Low cure temperature
  • Excellent bond strength, temperature resistance and toughness
  • 6 month shelf life
  • Available in pre-measured CC-Paks, bulk or syringes

Download the EP-900 data sheet.

Volume Resistivity: < 5 x 10-4 Ω-cm

Applications:

  • Component attachment & termination on hybrid circuits, membrane switches & other assemblies

Features:

  • One-Part epoxy
  • 30-day shelf life
  • Screen or stencil printing

Download the EP-1100 data sheet.

Surface Resistivity: @25°C 3.8 x 1014 Ω/square/mil

Applications:

  • Component encapsulation
  • Wire or component staking

Features:

  • 100% solids
  • Dot dispensable
  • Moisture resistant
  • Suitable for flexible substrates
  • Can be sprayed or dipped

Download the UV-3010 data sheet.

Applied Ink Solutions Product Matrix